PCB Manufacturing
HDI PCB & RF PCB
As a leading PCB manufacturer, we offers a full range of rigid board assembly from single / double sided upwards, but it also supports laser drilled microvias, cavity boards, heavy copper up to 30 oz., via-in-pad, microwave & RF PCB boards, up to 58 layers and others.
Rigid-Flex PCB & Flex PCB
We can offer the production of rigid-flex and flex PCBs and HDIs for high-reliability applications, with features down to 25 µm and flexible dielectric core down to 25 µm. With the revolution in portable communications products over the last decade, Rigid Flex PCB have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.
- Single layer flex PCB
- Double sided flex pcb
- Multilayer flex PCB
- Rigid flex PCB
- Quick turn Rigid flex
- HDI Micro via– blind, buried, staggered & stacked vias
- Microvias filled by epoxy and copper capped
- High speed requirements
- Large format Circuit
- Long flex pcb
- Long rigid flex PCB
- Layer count: 2~58L
- HDI PCB, High frequency pcb
- Blind / Buried Vias (Mechanical & Laser Drilling)
- Microvias filled by epoxy and copper capped
- Polyimide rigid pcb laminate (Alron85N, Isola P95, Isola P96, Ventec VT901 etc)
- Low loss pcb material (I-Speed material, FR408HR, Megtron4, EM-888, N4000-13EP, N4000-13, TU-863+, TU-872lk, TU-872SLK, TU-872SLK SP etc)
- High Speed Digital PCB laminate: (I-Tera MT40 / RF, Tachyon-100G,Megtron6/R-5775, TU-883, TU-883SP, IT-968, IT968SE etc)
- RF PCB, Microwave pcb laminate: (RO4450F, RO4350B, RO4835, RO4003, RO4533, Taconic TLY series, TLY-5, RF35, TSM-DS3, Astra MT77, RT/Duroid 5880, RO3203, RO3003 etc)
- BGA Pitch down to : 0.15mm (min)
- Min trace width/spacing: 0.002"/0.002"
- Staggered, Stacked and Skipped Microvias HDI: 9+N+9 (any-layer hdi)
- Back drill: Min hole size 15.7mils Depth tolerance +/-6mils
- Cavity PCB Process
